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Base Plate (Heat Sink)
・We have presses and uncoiler-levelers, and we can process copper coils up to 6 mm thick and sheet materials up to 5 mm thick.
・We design and manufacture both single-shot and progressive dies, enabling precise processing with clean shear surfaces through high-precision tooling.
・Our proprietary leveler enables micron-level flatness control, and we can also accommodate requests for special warpage shapes through custom die processing.
・We also process UV-curable resist printing, suitable for positioning applications such as on ceramic substrates.
Base-Plate
Supports a variety of shapes and resist resin patterns
UV-curable resist printing (green)
Bus-Bar
・With our expertise in single-shot and progressive die manufacturing for thick copper plates, we are capable of processing palm-sized busbars.
・As with base plates, we also handle plating processes such as Ni and Sn through close collaboration with our partner manufacturers.
・We can accommodate small-lot prototyping needs through methods such as simplified dies and wire-cut machining.
Bus-Bar (pressed product)
Fracture surface of a pressed product (plate thickness 5 mm)
Supports small-scale prototyping
Electrodes/Terminals/Heat spreaders, etc.
・Depending on customer requirements, we can process electrodes and terminals with material thicknesses ranging from 0.5 to 2.5 mm using single-shot or progressive dies.
・Through collaboration with our partner manufacturers, we offer a wide range of plating options—including pre-plating, post-plating, stripe plating, and selective plating—enabling us to provide products suitable for soldering and wire bonding.
・We have experience processing heat spreaders from 1.0 mm thickness, with flatness precisely controlled by our proprietary leveler.
Electrodes/Terminals/Heat spreaders
Supports a wide variety of shapes
Stripe plating processing example
Case
・In collaboration with plastic molding partners, we handle both insert and outsert molded cases.
Case
Insert case (before diver cut processing)
