・Depending on customer requirements, we can process electrodes and terminals with material thicknesses ranging from 0.5 to 2.5 mm using single-shot or progressive dies.
・Through collaboration with our partner manufacturers, we offer a wide range of plating options—including pre-plating, post-plating, stripe plating, and selective plating—enabling us to provide products suitable for soldering and wire bonding.
・We can also handle resin molding of insert/outsert cases through collaboration with partner manufacturers.



















