About Product
Electrode, Terminal-Pin, Bus-Bar
- We accept your orders for products about dimensional accuracy, solder wettability, bondability, and so on.
- You can order trial productions and small mass production, also processing besides press.
- We have technical capacities and know-how for processing copper and coppor alloy board, which have 0.5-2.0 mm thickness.
- We have perfect management system, from material arranement to processing and plating.
Base-Plate for Heat-Sink
- We can process metal boards MAX 5.0mm thickness.
- We realized reducing processing cost by adopting Uncoilars for thick coiled metal plates and progressive molds.
- We can wape our base-plates any level and direction by technology and know-how trained by the production of base-plates for power modules.
- You can order to print resist resin(UV hardened type) on plates.
Resin Molded Product(Subcontractors)
- Our subcontractors can Insert and Outsert mold process.
- We can bending and cutting metal parts after resin molded process.
